Nanopackaging

James E. Morris

• 23 oktober 2008
• 9780387473253

Samenvatting:

Nanotechnologies are being applied to microelectronics packaging, primarily in the applications of nanoparticle nanocomposites, or in the exploitation of the superior mechanical, electrical, or thermal properties of carbon nanotubes.

Nanopackaging: Nanotechnologies and Electronics Packaging presents a comprehensive overview of nanoscale electronics and systems packaging, and covers nanoscale structures, nanoelectronics packaging, nanowire applications in packaging, and offers a roadmap for future trends. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive "inks," underfill fillers, and solder enhancement.

Nanopackaging: Nanotechnologies and Electronics Packaging is an important reference for Industrial and academic researchers as well as practicing engineers seeking information about the latest techniques, including:

• The importance of computer modeling in nanopackaging and offers suggestions for implementation

• Carbon Nanotubes and Nanoparticles, and their role in packaging, including basic properties and fabrication, and applications in solder, thermal management, and EMI control

• A comprehensive overview of nanoscale electronics and systems packaging

Nanopackaging: Nanotechnologies and Electronics Packaging is an ideal reference for researchers, practicing engineers as well as graduate students who are either entering the field of for the first time, or those already conducting research and want to expand their knowledge in the field of nanopackaging.